Eliminating ring, chemical vapor deposition machine and method for placing eliminating ring on chemical vapor deposition machine
An exclusion ring for use in a processing chamber, such as a chemical vapor deposition chamber, to process a semiconductor substrate, a chemical vapor deposition station, and a method of placing the exclusion ring thereon. The exclusion ring includes a first alignment structure that mates with a sec...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | An exclusion ring for use in a processing chamber, such as a chemical vapor deposition chamber, to process a semiconductor substrate, a chemical vapor deposition station, and a method of placing the exclusion ring thereon. The exclusion ring includes a first alignment structure that mates with a second alignment structure on a stage on which the wafer is to be placed during processing of the wafer. The first alignment structure includes a guide surface that facilitates reception and positioning of the second alignment structure within the first alignment structure. A method of using the exclusion ring is also provided.
一种排除环、化学气相沉积机台及将于其上放置排除环的方法,排除环用在处理腔室,例如化学气相沉积腔室中以处理半导体基材。排除环包括第一对准结构,在晶圆的处理期间,第一对准结构与晶圆将放置的平台上的第二对准结构相配合。第一队准结构包含导引面,导引面促进第二对准结构在第一对准结构内的接收和定位。另提供排除环的使用方法。 |
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