Process solution for polymer treatment

Provided is a process solution for treating a polymer, which contains a polar aprotic solvent, a fluorine-based compound, and a sulfur-containing compound, has excellent storage stability, and is capable of minimizing damage to a metal layer while improving the ability to remove an adhesive polymer remaining on a circuit surface of a semiconductor wafer. 本发明提供一种高分子处理用工艺溶液，其包含极性非质子性溶剂、氟系化合物和含硫化合物，其保管稳定性优异，能够在提高对于残留在半导体晶圆电路面的粘接聚合物的去除力的同时使金属层的损伤最小化。