Polyurethane hot melt adhesive for low temperature application

Disclosed is a moisture-reactive polyurethane hot-melt adhesive composition which can be applied to a substrate at a low coating weight even at an application temperature as low as 60 DEG C to 95 DEG C, and meanwhile, favorable high viscosity, wet strength, curing adhesive strength and toughness of...

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Bibliographische Detailangaben
Hauptverfasser:	SUTAK JOHN, SHETTER JONATHAN P, BIEBEL, BRUCE, M
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY COMPOSITIONS BASED THEREON DYES MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	Disclosed is a moisture-reactive polyurethane hot-melt adhesive composition which can be applied to a substrate at a low coating weight even at an application temperature as low as 60 DEG C to 95 DEG C, and meanwhile, favorable high viscosity, wet strength, curing adhesive strength and toughness of a conventional high-melting-point polyurethane hot-melt adhesive are reserved. 公开一种湿气反应性聚氨酯热熔粘合剂组合物，所述湿气反应性聚氨酯热熔粘合剂组合物即使在低至60℃至95℃的施加温度下也可以以低涂层重量施加至基材，同时保留常规高熔点聚氨酯热熔粘合剂的有利高粘性、湿强度、固化粘合强度和韧性。