Laser cutting method and laser cutting equipment

The invention relates to a laser cutting method for cutting plate-shaped material and to an associated laser cutting device (1). According to the method, in a first step, the material to be cut is weakened, in particular perforated, by irradiation with a pulsed first laser beam (11) along an arranged cutting line (20). In a second step, the material to be cut is locally heated in the region of the cutting line (20) by irradiation with a second laser beam (13) in order to generate a material stress. In a second step, the material to be cut is heated in only one point (22) or in a plurality of mutually spaced points (22) on the cutting line (20). 说明了一种用于切割板状材料的激光切割方法和所属的激光切割设备(1)。根据方法，在第一步骤中，通过用脉冲式第一激光束(11)沿设置的切割线(20)进行照射，对要切割的材料进行弱化、尤其是穿孔。在第二步骤中，通过用第二激光束(13)进行照射，在切割线(20)的区域中对要切割的材料进行局部加热，用以产生材料应力。在此在第二步骤中，在切割线(20)上的仅一个点(22)中或多个相互间隔开的点(22)中对要切割的材料进行加热。