Apparatus and method for forming PCB engineered thermal path using auxiliary conductive layer

The invention relates to an apparatus and method for forming a PCB engineered thermal path using an auxiliary conductive layer. The method includes forming first and second auxiliary conductive layers on a top surface and a bottom surface of the PCB, respectively; milling or laser drilling the PCB f...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	LIANG JINGYE, LENG MIN, NEELY MATT
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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