Apparatus and method for forming PCB engineered thermal path using auxiliary conductive layer

The invention relates to an apparatus and method for forming a PCB engineered thermal path using an auxiliary conductive layer. The method includes forming first and second auxiliary conductive layers on a top surface and a bottom surface of the PCB, respectively; milling or laser drilling the PCB from the top surface to form a first cavity extending into the PCB; chemically plating a first side including the top surface and the first cavity with a first metal by using a horizontal or vertical plating system; electroplating the first side with a second metal by using a horizontal or vertical plating system to form a first plating layer on the first exposed surface of the PCB and fill the first cavity; milling or laser drilling the PCB from the bottom surface to form a second cavity extending into the PCB, the first cavity in thermal and/or electrical communication with the second cavity; chemically plating a second side including the bottom surface and a second cavity with a first metal; and forming a second