Circuit board manufacturing and wiring method for module replacement and transformation
The invention discloses a circuit board manufacturing and wiring method for module replacement and transformation, and the method comprises the steps: carrying out the modularization of the replacement and transformation of a new module and an old module in the form of a switching circuit board, and...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention discloses a circuit board manufacturing and wiring method for module replacement and transformation, and the method comprises the steps: carrying out the modularization of the replacement and transformation of a new module and an old module in the form of a switching circuit board, and enabling the butt-joint wires on the old module to be plugged into the corresponding butt-joint terminals of the switching circuit board according to groups during the batch transformation, a new module is respectively inserted into a corresponding switching terminal of the switching circuit board and a socket terminal of the new module by using a pre-manufactured cable with plugs at two ends, so that accurate correspondence of input and output point locations of different modules in the transformation and replacement process can be ensured, the error rate of wiring is reduced, the working efficiency of transformation is improved, and the cost is reduced. And the lightning protection function of the line is added, |
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