Semiconductor packaging device and preparation method thereof

The invention discloses a semiconductor packaging device and a preparation method thereof, and belongs to the technical field of semiconductor packaging. The preparation method comprises the steps that a first packaging body is provided, the first packaging body comprises a chip, first conductive columns and a protection layer, the chip is provided with a first main surface and a second main surface which are oppositely arranged, the first main surface is provided with a plurality of chip electrodes, the first conductive columns are located at the positions of the chip electrodes and electrically connected with the corresponding chip electrodes, and the protection layer is arranged on the first conductive columns; the protective layer covers the first conductive column; forming a first plastic packaging layer which covers the first packaging body from one side of the first main surface, and exposing the second main surface from the first plastic packaging layer; removing part of the first plastic package laye