Manufacturing and tape transfer methods for patterned preforms
The invention relates to a manufacturing method for a patterned preform on a transfer belt and to such a patterned preform, and to the use of a transfer belt as a carrier. The manufacturing method for a patterned preform comprises the steps of:-providing a patterned tape comprising a rigid substrate...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention relates to a manufacturing method for a patterned preform on a transfer belt and to such a patterned preform, and to the use of a transfer belt as a carrier. The manufacturing method for a patterned preform comprises the steps of:-providing a patterned tape comprising a rigid substrate and a tape, where the tape is made of polyimide or polydimethylsiloxane, where the rigid substrate is at least partially covered by the tape, and where the tape comprises a pattern of recesses; and-at least partially filling the recesses of the patterned tape with an electrically conductive material to obtain the patterned preform. The conductive material includes a mixture of a first component having a first melting point and a second component having a second melting point different from the first melting point.
本发明涉及一种用于转移带上的图案化预成型件的制造方法和这样的图案化预成型件,以及使用转移带作为载体。用于图案化预成型件的该制造方法包括以下步骤:-提供包括刚性基底和带的图案化带,其中该带由聚酰亚胺或聚二甲基硅氧烷制成,其中该刚性基底至少部分地被该带覆盖,并且其中该带包括凹陷部的图案;以及-由导电材料至少部分地填充该图案化带的该凹陷部以获得该图案化预成型件。该导电材料包括具有第一熔点的第一组分和具有第二熔 |
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