Full-automatic semiconductor plastic packaging equipment and method

The invention discloses full-automatic semiconductor plastic packaging equipment and method, and relates to the field of semiconductor packaging, and the equipment comprises a feeding and chip arranging device, a feeding and glue discharging device, a plastic packaging device, a glue removing device and a carrying device; the feeding and glue discharging device comprises a feeding vibration disc and a transfer discharging mechanism; the transfer discharging mechanism comprises a discharging mechanism and a transferring mechanism, the discharging mechanism comprises a discharging seat and a discharging driving mechanism, and a discharging storage groove is formed in the discharging seat; the transfer mechanism comprises a grabbing piece and a transfer driving mechanism; the plastic packaging device comprises a plastic packaging mold and a cleaning mechanism; the plastic package mold comprises an upper mold and a lower mold; the sweeping mechanism comprises an air blowing assembly and an air blowing driving mec