Automatic polishing solution cooling system for silicon carbide polishing
The invention relates to the technical field of semiconductor material polishing, and discloses a polishing solution cooling automation system for silicon carbide polishing, the polishing solution cooling automation system comprises a base, and an auxiliary cooling box, a filter box and a main cooli...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention relates to the technical field of semiconductor material polishing, and discloses a polishing solution cooling automation system for silicon carbide polishing, the polishing solution cooling automation system comprises a base, and an auxiliary cooling box, a filter box and a main cooling box which are located on the base, the main cooling box is also provided with a heat dissipation box, and the heat dissipation box is provided with heat dissipation holes for communicating with the main cooling box; a first cooling assembly is arranged in the main cooling box and comprises a cooling fan, a rotating pipe and a stirring pipe, the rotating pipe is rotationally connected with the cooling box, one end of the rotating pipe is connected with one end of the stirring pipe, the other end of the rotating pipe is rotationally and hermetically connected with a cooling liquid inlet pipe, and the other end of the stirring pipe is rotationally connected with the base; the other end of the stirring pipe is furth |
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