Drying treatment device used after wafer cleaning

The invention discloses a device for drying a cleaned wafer, and the device comprises a clamp which is used for clamping the wafer; an air supply mechanism; the drying unit comprises two drying groups, and the two drying groups are arranged on the two sides of the wafer along the axis of the wafer;...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	SHEN QILIANG, LIAO SHIRONG, KUNG CHENGIH
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BLASTING DRYING DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM HEATING LIGHTING MECHANICAL ENGINEERING WEAPONS
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