Drying treatment device used after wafer cleaning

The invention discloses a device for drying a cleaned wafer, and the device comprises a clamp which is used for clamping the wafer; an air supply mechanism; the drying unit comprises two drying groups, and the two drying groups are arranged on the two sides of the wafer along the axis of the wafer; the drying set comprises a first air supply part, a second air supply part and a third air supply part, a first air supply cavity is formed in the first air supply part, a plurality of first air outlet holes are formed in the first air supply part, the first air outlet holes are all communicated with the first air supply cavity, and the first air outlet holes face the wafer; and the first air supply cavity is communicated with the air supply mechanism. After the cleaned wafer is clamped by the clamp, high-temperature gas is introduced into the first gas supply cavity of the gas supply mechanism box, and the wafer is dried through the first gas outlet holes. The two surfaces of the wafer can be dried at the same tim