Electrolytic copper plate holding strip raw material processing technology
The invention provides an electrolytic copper plate clamping strip raw material processing technology. The electrolytic copper plate clamping strip raw material processing technology comprises the following steps: S1, material preparation: uniformly mixing polyphenyl ether, polystyrene, a main antio...
Gespeichert in:
Hauptverfasser: | , |
---|---|
Format: | Patent |
Sprache: | chi ; eng |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Zusammenfassung: | The invention provides an electrolytic copper plate clamping strip raw material processing technology. The electrolytic copper plate clamping strip raw material processing technology comprises the following steps: S1, material preparation: uniformly mixing polyphenyl ether, polystyrene, a main antioxidant, an auxiliary antioxidant, a lubricant, a flexibilizer, a sodium dodecyl benzene sulfonate graft and calcium stearate according to a ratio; s2, feeding: adding the materials prepared in the step 2 into a hopper of a main machine; s3, heating: performing temperature control heating on the mixture by adopting sections, wherein the temperature of the first area is 260 DEG C, the temperature of the second area is 255 DEG C, the temperature of the third area is 240 DEG C, the temperature of the fourth area is 250 DEG C, and the temperature of the fifth area is 265 DEG C; s4, extrusion: extruding the heated and melted raw materials by an extruder; s5, cooling: cooling the extruded and molded filaments with cooling |
---|