Offset layer slicing and offset layer forming for photopolymerization curing molded additive manufacturing parts
The invention provides an offset layer slicing and offset layer forming for photopolymerization curing molded additive manufacturing parts. A method of additive manufacturing a component via photopolymerization cure molding (VPP) includes irradiating a first material through a first transparent wall...
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Format: | Patent |
Sprache: | chi ; eng |
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