Offset layer slicing and offset layer forming for photopolymerization curing molded additive manufacturing parts

The invention provides an offset layer slicing and offset layer forming for photopolymerization curing molded additive manufacturing parts. A method of additive manufacturing a component via photopolymerization cure molding (VPP) includes irradiating a first material through a first transparent wall of a first material slot and forming a first section of an n-th layer of the component on a platform; positioning the platform having the first section of the n-th layer in a second material tank with a distance between the first section of the n-th layer and a second transparent wall; and irradiating a second material such that a second section of the n-th layer of the component is formed on the platform adjacent to the first section of the n-th layer. The method repeats forming the first and second sections of the additional layer until a predetermined total number of layers is formed. Positioning the first section and the second section at a distance from the second transparent wall and the first transparent wa