Pr or Sm reinforced Sn-58Bi lead-free solder

The invention relates to a Pr or Sm reinforced Sn-58Bi lead-free solder, which comprises the following components in percentage by mass: 0.5 to 2 percent of Pr or 0.1 to 2 percent of Sm, 55 to 60 percent of Bi and the balance of Sn. According to the lead-free solder, oxidation resistance and wettabi...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: JIANG YAN, LI ZIJING, LUO TINGBI
Format: Patent
Sprache:chi ; eng
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