Pr or Sm reinforced Sn-58Bi lead-free solder

Pr or Sm reinforced Sn-58Bi lead-free solder

The invention relates to a Pr or Sm reinforced Sn-58Bi lead-free solder, which comprises the following components in percentage by mass: 0.5 to 2 percent of Pr or 0.1 to 2 percent of Sm, 55 to 60 percent of Bi and the balance of Sn. According to the lead-free solder, oxidation resistance and wettabi...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: JIANG YAN, LI ZIJING, LUO TINGBI
Format: Patent
Sprache:chi ; eng
Schlagworte:
CLADDING OR PLATING BY SOLDERING OR WELDING
CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING
MACHINE TOOLS
METAL-WORKING NOT OTHERWISE PROVIDED FOR
PERFORMING OPERATIONS
SOLDERING OR UNSOLDERING
TRANSPORTING
WELDING
WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:The invention relates to a Pr or Sm reinforced Sn-58Bi lead-free solder, which comprises the following components in percentage by mass: 0.5 to 2 percent of Pr or 0.1 to 2 percent of Sm, 55 to 60 percent of Bi and the balance of Sn. According to the lead-free solder, oxidation resistance and wettability can be effectively improved, meanwhile, mechanical properties such as ductility and strength are improved, the welding quality is improved, the rejection rate is reduced, finally, the quality of electronic products is improved, and the production cost is reduced. 一种Pr或Sm强化的Sn-58Bi无铅焊料，其组分及其质量百分比为：Pr 0.5-2wt.％或者Sm 0.1-2wt.％，Bi 55-60wt.％，余量为Sn。本发明的无铅焊料可以有效提高抗氧化性和润湿性，同时改善延展性和强度等机械性能，提高焊接质量，降低废品率，最终提高电子产品的质量，并降低生产成本。