Pr or Sm reinforced Sn-58Bi lead-free solder
The invention relates to a Pr or Sm reinforced Sn-58Bi lead-free solder, which comprises the following components in percentage by mass: 0.5 to 2 percent of Pr or 0.1 to 2 percent of Sm, 55 to 60 percent of Bi and the balance of Sn. According to the lead-free solder, oxidation resistance and wettabi...
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| creator | JIANG YAN LI ZIJING LUO TINGBI |
| description | The invention relates to a Pr or Sm reinforced Sn-58Bi lead-free solder, which comprises the following components in percentage by mass: 0.5 to 2 percent of Pr or 0.1 to 2 percent of Sm, 55 to 60 percent of Bi and the balance of Sn. According to the lead-free solder, oxidation resistance and wettability can be effectively improved, meanwhile, mechanical properties such as ductility and strength are improved, the welding quality is improved, the rejection rate is reduced, finally, the quality of electronic products is improved, and the production cost is reduced.
一种Pr或Sm强化的Sn-58Bi无铅焊料，其组分及其质量百分比为：Pr 0.5-2wt.％或者Sm 0.1-2wt.％，Bi 55-60wt.％，余量为Sn。本发明的无铅焊料可以有效提高抗氧化性和润湿性，同时改善延展性和强度等机械性能，提高焊接质量，降低废品率，最终提高电子产品的质量，并降低生产成本。 |
| format | Patent |
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一种Pr或Sm强化的Sn-58Bi无铅焊料，其组分及其质量百分比为：Pr 0.5-2wt.％或者Sm 0.1-2wt.％，Bi 55-60wt.％，余量为Sn。本发明的无铅焊料可以有效提高抗氧化性和润湿性，同时改善延展性和强度等机械性能，提高焊接质量，降低废品率，最终提高电子产品的质量，并降低生产成本。</description><language>chi ; eng</language><subject>CLADDING OR PLATING BY SOLDERING OR WELDING ; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ; MACHINE TOOLS ; METAL-WORKING NOT OTHERWISE PROVIDED FOR ; PERFORMING OPERATIONS ; SOLDERING OR UNSOLDERING ; TRANSPORTING ; WELDING ; WORKING BY LASER BEAM</subject><creationdate>2022</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20220527&DB=EPODOC&CC=CN&NR=114535860A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20220527&DB=EPODOC&CC=CN&NR=114535860A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>JIANG YAN</creatorcontrib><creatorcontrib>LI ZIJING</creatorcontrib><creatorcontrib>LUO TINGBI</creatorcontrib><title>Pr or Sm reinforced Sn-58Bi lead-free solder</title><description>The invention relates to a Pr or Sm reinforced Sn-58Bi lead-free solder, which comprises the following components in percentage by mass: 0.5 to 2 percent of Pr or 0.1 to 2 percent of Sm, 55 to 60 percent of Bi and the balance of Sn. According to the lead-free solder, oxidation resistance and wettability can be effectively improved, meanwhile, mechanical properties such as ductility and strength are improved, the welding quality is improved, the rejection rate is reduced, finally, the quality of electronic products is improved, and the production cost is reduced.
一种Pr或Sm强化的Sn-58Bi无铅焊料，其组分及其质量百分比为：Pr 0.5-2wt.％或者Sm 0.1-2wt.％，Bi 55-60wt.％，余量为Sn。本发明的无铅焊料可以有效提高抗氧化性和润湿性，同时改善延展性和强度等机械性能，提高焊接质量，降低废品率，最终提高电子产品的质量，并降低生产成本。</description><subject>CLADDING OR PLATING BY SOLDERING OR WELDING</subject><subject>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</subject><subject>MACHINE TOOLS</subject><subject>METAL-WORKING NOT OTHERWISE PROVIDED FOR</subject><subject>PERFORMING OPERATIONS</subject><subject>SOLDERING OR UNSOLDERING</subject><subject>TRANSPORTING</subject><subject>WELDING</subject><subject>WORKING BY LASER BEAM</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2022</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZNAJKFLIL1IIzlUoSs3MS8svSk5NUQjO0zW1cMpUyElNTNFNK0pNVSjOz0lJLeJhYE1LzClO5YXS3AyKbq4hzh66qQX58anFBYnJqXmpJfHOfoaGJqbGphZmBo7GxKgBAOquKE0</recordid><startdate>20220527</startdate><enddate>20220527</enddate><creator>JIANG YAN</creator><creator>LI ZIJING</creator><creator>LUO TINGBI</creator><scope>EVB</scope></search><sort><creationdate>20220527</creationdate><title>Pr or Sm reinforced Sn-58Bi lead-free solder</title><author>JIANG YAN ; LI ZIJING ; LUO TINGBI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN114535860A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2022</creationdate><topic>CLADDING OR PLATING BY SOLDERING OR WELDING</topic><topic>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</topic><topic>MACHINE TOOLS</topic><topic>METAL-WORKING NOT OTHERWISE PROVIDED FOR</topic><topic>PERFORMING OPERATIONS</topic><topic>SOLDERING OR UNSOLDERING</topic><topic>TRANSPORTING</topic><topic>WELDING</topic><topic>WORKING BY LASER BEAM</topic><toplevel>online_resources</toplevel><creatorcontrib>JIANG YAN</creatorcontrib><creatorcontrib>LI ZIJING</creatorcontrib><creatorcontrib>LUO TINGBI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>JIANG YAN</au><au>LI ZIJING</au><au>LUO TINGBI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Pr or Sm reinforced Sn-58Bi lead-free solder</title><date>2022-05-27</date><risdate>2022</risdate><abstract>The invention relates to a Pr or Sm reinforced Sn-58Bi lead-free solder, which comprises the following components in percentage by mass: 0.5 to 2 percent of Pr or 0.1 to 2 percent of Sm, 55 to 60 percent of Bi and the balance of Sn. According to the lead-free solder, oxidation resistance and wettability can be effectively improved, meanwhile, mechanical properties such as ductility and strength are improved, the welding quality is improved, the rejection rate is reduced, finally, the quality of electronic products is improved, and the production cost is reduced.
一种Pr或Sm强化的Sn-58Bi无铅焊料，其组分及其质量百分比为：Pr 0.5-2wt.％或者Sm 0.1-2wt.％，Bi 55-60wt.％，余量为Sn。本发明的无铅焊料可以有效提高抗氧化性和润湿性，同时改善延展性和强度等机械性能，提高焊接质量，降低废品率，最终提高电子产品的质量，并降低生产成本。</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM |
| title | Pr or Sm reinforced Sn-58Bi lead-free solder |
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