Laser edge welding of copper substrates

The present disclosure provides laser edge welding of copper substrates. A method of joining electrical connections together includes evaluating at least one solder joint between at least two substrates, determining a mismatch between the at least two substrates, and soldering the at least two substrates together with a multi-step soldering process. The multi-step welding process comprises compensating for mismatch between the at least two substrates by welding on both sides of a bond line between the at least two substrates without overlapping the bond line with a first welding step and increasing melt volume and penetration depth of a weld between the at least two substrates with a second welding step and degree. 本公开提供了"铜基板的激光边缘焊接"。一种将电气连接件接合在一起的方法包括评估至少两个基板之间的至少一个焊接接头、确定所述至少两个基板之间的失配，以及用多步焊接过程将所述至少两个基板焊接在一起。所述多步焊接过程包括通过用第一焊接步骤在所述至少两个基板之间的接合线的两侧上但不与所述接合线重叠地焊接来补偿所述至少两个基板之间的失配以及用第二焊接步骤增加所述至少两个基板之间的焊缝的熔体体积和渗透深度。