Silica sol active abrasive particle for chemical mechanical polishing and preparation method thereof

The invention discloses a silica sol active abrasive particle for chemical mechanical polishing, the silica sol abrasive particle has a non-spherical shape, and the silica sol abrasive particle comprises a manganese dioxide compound with chemical activity. The invention provides a silica sol active...

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Hauptverfasser: CHEN YI, YANG XIAOQIANG, LEI YIFAN, LEI HONG, CHEN WEIWEI, ZHANG BAICHUN, DONG YUE, ZHOU DAIYUAN
Format: Patent
Sprache:chi ; eng
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Zusammenfassung:The invention discloses a silica sol active abrasive particle for chemical mechanical polishing, the silica sol abrasive particle has a non-spherical shape, and the silica sol abrasive particle comprises a manganese dioxide compound with chemical activity. The invention provides a silica sol active abrasive particle for chemical mechanical polishing and a preparation method. The silica sol active abrasive particle has a non-spherical appearance, and the outer surface of the silica sol active abrasive particle contains a manganese dioxide compound with chemical activity; and the sapphire polishing efficiency can be remarkably improved. 本发明公开了一种用于化学机械抛光的硅溶胶活性磨粒,所述硅溶胶磨粒具有非球状外形,且所述硅溶胶磨粒包含具有化学活性的二氧化锰化合物。本发明提供的一种用于化学机械抛光的硅溶胶活性磨粒及制备方法,该硅溶胶磨粒具有非球状外形,且外表面包含具有化学活性的二氧化锰化合物;可以显著提高蓝宝石的抛光效率。