Package carrier and manufacturing method thereof

The invention provides a package carrier and a manufacturing method thereof. The package carrier includes a circuit structure layer and a heat conducting member. The circuit structure layer includes a gap portion. The heat conduction piece comprises a first heat conduction part and a second heat conduction part vertically connected to the first heat conduction part. The notch part exposes the first heat conduction part, and the outer surface of the second heat conduction part is flush with the side surface of the circuit structure layer. The first heat conduction part of the heat conduction piece is embedded in the circuit structure layer, and the second heat conduction part is attached to one side of the circuit structure layer and is exposed to the outside, so that the contact area with the outside can be increased, and the package carrier can have better heat dissipation efficiency. 本发明提供一种封装载板及其制作方法。封装载板包括线路结构层以及导热件。线路结构层包括缺口部。导热件包括第一导热部及垂直连接于第一导热部的第二导热部。缺口部暴露出第一导热部，而第二导热部的外表面切齐于线路结构层的侧表面。本发明的导热件的第一导热部是内埋