Mask package for preventing degradation during fabrication of high aspect ratio features

A tool and method for fabricating high aspect ratio features with very tight critical size control for processing a substrate by encapsulating a mask to prevent degradation during etch back, thereby preventing feature liner material from pinching off an opening during a deposition-etch cycle. 一种用于制造...

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Bibliographische Detailangaben
Hauptverfasser: HENRI JON, ROBERTS FRANCIS SLOAN, REDDY, KAPUR, SURESH
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:A tool and method for fabricating high aspect ratio features with very tight critical size control for processing a substrate by encapsulating a mask to prevent degradation during etch back, thereby preventing feature liner material from pinching off an opening during a deposition-etch cycle. 一种用于制造具有非常严密的关键尺寸控制的高深宽比特征的工具和方法,其用于通过以下方式来处理衬底:封装掩模以防止在回蚀刻期间退化,从而防止特征衬垫材料在沉积-蚀刻循环期间夹断开口。