SMT patch production process

SMT patch production process

The invention discloses an SMT patch production process, which comprises a supporting case, an electric power case and a lower case, supporting legs are arranged at four corners of the outer wall of the bottom of the supporting case and four corners of the outer wall of the bottom of the electric po...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: ZHANG LIANG, ZHU BANGYI, SHAO SHICONG
Format: Patent
Sprache:chi ; eng
Schlagworte:
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator ZHANG LIANG
ZHU BANGYI
SHAO SHICONG
description The invention discloses an SMT patch production process, which comprises a supporting case, an electric power case and a lower case, supporting legs are arranged at four corners of the outer wall of the bottom of the supporting case and four corners of the outer wall of the bottom of the electric power case, a first storage case is arranged on the outer wall of the top of the supporting case, and a second storage case is arranged on the outer wall of the top of the electric power case. The inner wall of the first storage case and the inner wall of the second storage case are each provided with a first electric sliding rail. According to the SMT patch production process disclosed by the invention, the pressure difference is formed at the heated moving box and the adsorption nozzle, the pressure difference is convenient for gas to automatically flow into the moving box from the adsorption nozzle, the adsorption force is stronger, shaking is avoided when the PCB is subjected to patch, dust can be efficiently ads
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN114501981A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN114501981A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN114501981A3</originalsourceid><addsrcrecordid>eNrjZJAJ9g1RKEgsSc5QKCjKTylNLsnMzwMxk1OLi3kYWNMSc4pTeaE0N4Oim2uIs4duakF-fGpxQWJyal5qSbyzn6GhiamBoaWFoaMxMWoAkiwjqQ</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>SMT patch production process</title><source>esp@cenet</source><creator>ZHANG LIANG ; ZHU BANGYI ; SHAO SHICONG</creator><creatorcontrib>ZHANG LIANG ; ZHU BANGYI ; SHAO SHICONG</creatorcontrib><description>The invention discloses an SMT patch production process, which comprises a supporting case, an electric power case and a lower case, supporting legs are arranged at four corners of the outer wall of the bottom of the supporting case and four corners of the outer wall of the bottom of the electric power case, a first storage case is arranged on the outer wall of the top of the supporting case, and a second storage case is arranged on the outer wall of the top of the electric power case. The inner wall of the first storage case and the inner wall of the second storage case are each provided with a first electric sliding rail. According to the SMT patch production process disclosed by the invention, the pressure difference is formed at the heated moving box and the adsorption nozzle, the pressure difference is convenient for gas to automatically flow into the moving box from the adsorption nozzle, the adsorption force is stronger, shaking is avoided when the PCB is subjected to patch, dust can be efficiently ads</description><language>chi ; eng</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS</subject><creationdate>2022</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20220513&amp;DB=EPODOC&amp;CC=CN&amp;NR=114501981A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76294</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20220513&amp;DB=EPODOC&amp;CC=CN&amp;NR=114501981A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>ZHANG LIANG</creatorcontrib><creatorcontrib>ZHU BANGYI</creatorcontrib><creatorcontrib>SHAO SHICONG</creatorcontrib><title>SMT patch production process</title><description>The invention discloses an SMT patch production process, which comprises a supporting case, an electric power case and a lower case, supporting legs are arranged at four corners of the outer wall of the bottom of the supporting case and four corners of the outer wall of the bottom of the electric power case, a first storage case is arranged on the outer wall of the top of the supporting case, and a second storage case is arranged on the outer wall of the top of the electric power case. The inner wall of the first storage case and the inner wall of the second storage case are each provided with a first electric sliding rail. According to the SMT patch production process disclosed by the invention, the pressure difference is formed at the heated moving box and the adsorption nozzle, the pressure difference is convenient for gas to automatically flow into the moving box from the adsorption nozzle, the adsorption force is stronger, shaking is avoided when the PCB is subjected to patch, dust can be efficiently ads</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2022</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZJAJ9g1RKEgsSc5QKCjKTylNLsnMzwMxk1OLi3kYWNMSc4pTeaE0N4Oim2uIs4duakF-fGpxQWJyal5qSbyzn6GhiamBoaWFoaMxMWoAkiwjqQ</recordid><startdate>20220513</startdate><enddate>20220513</enddate><creator>ZHANG LIANG</creator><creator>ZHU BANGYI</creator><creator>SHAO SHICONG</creator><scope>EVB</scope></search><sort><creationdate>20220513</creationdate><title>SMT patch production process</title><author>ZHANG LIANG ; ZHU BANGYI ; SHAO SHICONG</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN114501981A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2022</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><toplevel>online_resources</toplevel><creatorcontrib>ZHANG LIANG</creatorcontrib><creatorcontrib>ZHU BANGYI</creatorcontrib><creatorcontrib>SHAO SHICONG</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>ZHANG LIANG</au><au>ZHU BANGYI</au><au>SHAO SHICONG</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>SMT patch production process</title><date>2022-05-13</date><risdate>2022</risdate><abstract>The invention discloses an SMT patch production process, which comprises a supporting case, an electric power case and a lower case, supporting legs are arranged at four corners of the outer wall of the bottom of the supporting case and four corners of the outer wall of the bottom of the electric power case, a first storage case is arranged on the outer wall of the top of the supporting case, and a second storage case is arranged on the outer wall of the top of the electric power case. The inner wall of the first storage case and the inner wall of the second storage case are each provided with a first electric sliding rail. According to the SMT patch production process disclosed by the invention, the pressure difference is formed at the heated moving box and the adsorption nozzle, the pressure difference is convenient for gas to automatically flow into the moving box from the adsorption nozzle, the adsorption force is stronger, shaking is avoided when the PCB is subjected to patch, dust can be efficiently ads</abstract><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language chi ; eng
recordid cdi_epo_espacenet_CN114501981A
source esp@cenet
subjects CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
title SMT patch production process
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-22T22%3A39%3A00IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=ZHANG%20LIANG&rft.date=2022-05-13&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ECN114501981A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true