SMT patch production process

The invention discloses an SMT patch production process, which comprises a supporting case, an electric power case and a lower case, supporting legs are arranged at four corners of the outer wall of the bottom of the supporting case and four corners of the outer wall of the bottom of the electric power case, a first storage case is arranged on the outer wall of the top of the supporting case, and a second storage case is arranged on the outer wall of the top of the electric power case. The inner wall of the first storage case and the inner wall of the second storage case are each provided with a first electric sliding rail. According to the SMT patch production process disclosed by the invention, the pressure difference is formed at the heated moving box and the adsorption nozzle, the pressure difference is convenient for gas to automatically flow into the moving box from the adsorption nozzle, the adsorption force is stronger, shaking is avoided when the PCB is subjected to patch, dust can be efficiently ads