Heat dissipation device and electronic equipment
The embodiment of the invention discloses a heat dissipation device and electronic equipment, and the heat dissipation device comprises a rigid pipe which is provided with a first accommodation cavity; the first capillary structure is arranged in the first accommodating cavity; the flexible pipe is...
Gespeichert in:
| Hauptverfasser: | , , |
|---|---|
| Format: | Patent |
| Sprache: | chi ; eng |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| Zusammenfassung: | The embodiment of the invention discloses a heat dissipation device and electronic equipment, and the heat dissipation device comprises a rigid pipe which is provided with a first accommodation cavity; the first capillary structure is arranged in the first accommodating cavity; the flexible pipe is connected with the rigid pipe and is provided with a second accommodating cavity; the second accommodating cavity is communicated with the first accommodating cavity; the second capillary structure is arranged in the second accommodating cavity, is connected with the first capillary structure and can deform; wherein the heat dissipation device can deform based on the flexible pipe. According to the heat dissipation device provided by the embodiment of the invention, the heat dissipation device can be deformed through the flexible pipe and the second capillary structure, so that the heat dissipation device has deformation capacity, the heat dissipation device can have different shapes through the deformation of the |
|---|