Fine-line-spacing circuit board structure and manufacturing method thereof

The invention discloses a fine line spacing circuit board structure and a manufacturing method thereof. The manufacturing method comprises the following steps: forming a modified ceramic coating on the surface of a metal substrate; the modified ceramic coating is removed under the condition that the...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	YANG LUXING
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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