Fine-line-spacing circuit board structure and manufacturing method thereof

The invention discloses a fine line spacing circuit board structure and a manufacturing method thereof. The manufacturing method comprises the following steps: forming a modified ceramic coating on the surface of a metal substrate; the modified ceramic coating is removed under the condition that the modified ceramic coating is etched or the surface of the metal base material is directly etched, and a circuit groove with a pattern is obtained; a conductive pattern is generated in the circuit groove through an electroplating or chemical plating method; and etching the back surface of the metal base material by adopting an etching method, and stopping etching when the conductive pattern is etched. According to the invention, the use of a traditional copper-clad substrate is avoided, the fine line spacing forming effect of the conductive pattern is good, and the performance of the circuit board is improved. 本发明揭示了细线距电路板结构及其制造方法，制造方法包括以下步骤：金属基材表面形成改性陶瓷涂层；对改性陶瓷涂层刻蚀或直接在金属基材表面刻蚀情况下省去改性陶瓷涂层，得到具有图形的线路沟槽；通过电镀或化学镀方法使得线路沟