Printed circuit board, circuit board printing method and circuit board debugging method
According to the printed circuit board, the printing method of the printed circuit board and the debugging method of the printed circuit board, the pads of the preset specification of the printed circuit board at least comprise the first pad and the second pad which are oppositely arranged, and the...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | According to the printed circuit board, the printing method of the printed circuit board and the debugging method of the printed circuit board, the pads of the preset specification of the printed circuit board at least comprise the first pad and the second pad which are oppositely arranged, and the electrical gap between the two pads is short. The first bonding pad and the second bonding pad can be short-circuited in a tin connection mode in early-stage testing and verification, the zero-ohm function is achieved, and the first bonding pad and the second bonding pad can be disconnected or connected with other assemblies by removing tin connection through soldering iron in the later-stage using process. The problem that a large number of zero-ohm resistors are used in the early-stage design of the circuit board to affect the production efficiency is avoided, damage to the circuit board caused by using a short bonding pad is reduced, design and use are facilitated, and then the use experience is improved.
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