ELECTRONIC DEVICE MODULE, METHOD OF MANUFACTURING ELECTRONIC DEVICE MODULE, AND ELECTRONIC APPARATUS

The invention provides an electronic device module, a method of manufacturing the electronic device module, and an electronic apparatus. The electronic device module includes: a first plate having a first surface and a second surface facing opposite directions; the electronic devices are mounted on...

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Bibliographische Detailangaben
1. Verfasser:	IM SUNG WON
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	The invention provides an electronic device module, a method of manufacturing the electronic device module, and an electronic apparatus. The electronic device module includes: a first plate having a first surface and a second surface facing opposite directions; the electronic devices are mounted on the first surface and the second surface respectively; a second plate coupled to the second surface and including a device accommodating portion accommodating a portion of the electronic devices, where the device accommodating portion is formed by an opening of the second plate; a first flexible printed circuit board including a first end portion and a second end portion disposed on opposite ends of the first flexible printed circuit board, where the first flexible printed circuit board is more flexible than the first board and the second board, and where the first end portion is integrally formed with the second board, and where the second end portion is integrally formed with the first board. A second plate elect