Heat dissipation cover of chip test seat

The invention relates to the technical field of chip testing, and discloses a heat dissipation cover of a chip testing seat. The heat dissipation cover of the chip test seat comprises a connecting seat, a turnover cover and a heat dissipation device. The connecting seat is used for connecting a test base of the chip test seat. And the folding cover is rotationally connected with the connecting seat and can be opened and closed relative to the connecting seat. A heat dissipation device is arranged between the connecting base and the folding cover and can move in the axial direction of the folding cover. The heat dissipation device comprises a heat conduction block and a semiconductor chilling plate; the heat conduction block comprises a heat conduction end and a heat dissipation end, the heat conduction end is configured to abut against the chip to be tested, and the heat dissipation end is communicated with the outside of the heat dissipation cover of the chip test seat. The semiconductor chilling plate compr