Current sensor
The invention provides a current sensor which comprises a printed circuit board, the edge of a primary side is provided with a plurality of first conductive semi-hole structures penetrating through the thickness direction of the printed circuit board, and the edge of a secondary side is provided wit...
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| Hauptverfasser: | , , , |
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| Format: | Patent |
| Sprache: | chi ; eng |
| Schlagworte: | |
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| Zusammenfassung: | The invention provides a current sensor which comprises a printed circuit board, the edge of a primary side is provided with a plurality of first conductive semi-hole structures penetrating through the thickness direction of the printed circuit board, and the edge of a secondary side is provided with a plurality of second conductive semi-hole structures penetrating through the thickness direction of the printed circuit board. The surface of one side of the printed circuit board is provided with a plurality of third bonding pads electrically connected with the second conductive semi-hole structure, and the third bonding pads are located between the second conductive semi-hole structure and the first conductive semi-hole structure. The distance between the third bonding pad and the second conductive semi-hole structure is smaller than the distance between the third bonding pad and the first conductive semi-hole structure. And the front surface of the chip packaging structure is provided with a plurality of firs |
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