Cutter machining method and cutter

The invention provides a cutter machining method and a cutter, and the cutter machining method comprises the following steps that S10, a cutter body is prepared, and the cutter body comprises a cutting edge part; s20, plating a first layer of film on the surface of the blade part by adopting a physical vapor deposition method, wherein the first layer of film comprises at least one of TiN, TiNC, TiC, C or N; and S30, plating a second layer of film on the basis of the first layer of film by adopting a physical vapor deposition method, wherein the second layer of film comprises antibacterial ions. According to the cutter machining method, the technology is simple, abrasion is not prone to occurring, and the durable antibacterial effect is achieved. 本申请提供了一种刀具加工方法与刀具，刀具加工方法包括以下步骤：步骤S10：制备刀体，所述刀体包括刀刃部；步骤S20：采用物理气相沉积法在所述刀刃部的表面镀第一层膜，所述第一层膜包括TiN、TiNC、TiC、C或N中的至少一种；步骤S30：采用物理气相沉积法在所述第一层膜的基础上镀第二层膜，所述第二层膜包括抗菌离子。本申请可以提供一种工艺简单、不易磨损且具有持久抗菌效果的刀具加工方法。