Multi-layer glass substrate process and structure based on heterogeneous bonding

The invention discloses a multi-layer glass substrate process based on heterogeneous bonding, which comprises the following steps of: etching a groove on the surface of a glass substrate, depositing metal to form a metal circuit in the groove, and then covering an inorganic dielectric layer; manufacturing a Via connection structure connected with the metal circuit to obtain a single-layer unit; and according to wiring requirements, stacking the at least two single-layer units up and down, enabling the Via connection structures to correspond to each other, and forming the multi-layer glass substrate through glass/metal heterogeneous bonding. According to the invention, the glass substrate structure embedded with multiple layers of wiring is realized, fine line width and line distance can be realized, high-density wiring is satisfied, and the glass substrate structure has better performance and wider application. 本发明公开了一种基于异质键合的多层玻璃基板工艺，是于玻璃基板表面蚀刻出沟槽，沉积金属于沟槽中形成金属线路，然后覆盖无机介质层；再制作出与金属线路连接的Via连接结构，得到单层单元；根据布线要求，将至