Laser grinding device, grinding method, ceramic part and shell assembly
The invention provides a laser grinding device, a grinding method, a ceramic part and a shell assembly. The laser grinding machining device comprises an objective table used for placing a workpiece to be machined; laser emitted by the laser emission source enters the laser processing system, the las...
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| creator | HU MAOSHUN |
| description | The invention provides a laser grinding device, a grinding method, a ceramic part and a shell assembly. The laser grinding machining device comprises an objective table used for placing a workpiece to be machined; laser emitted by the laser emission source enters the laser processing system, the laser irradiates the surface of a to-be-processed workpiece to form a reaction layer, and the hardness of the reaction layer is smaller than that of the to-be-processed workpiece; a frame; the grinding assembly is arranged on the frame and used for grinding and removing the reaction layer. The hardness of the reaction layer is smaller than that of the to-be-machined part, the removal strength of the grinding assembly can be reduced, then the risk that cracks are generated in the non-machining area of the to-be-machined part in the grinding machining process is avoided, the surface quality of the to-be-machined part after grinding machining is improved, the grinding speed is increased, and the removal efficiency of the |
| format | Patent |
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The laser grinding machining device comprises an objective table used for placing a workpiece to be machined; laser emitted by the laser emission source enters the laser processing system, the laser irradiates the surface of a to-be-processed workpiece to form a reaction layer, and the hardness of the reaction layer is smaller than that of the to-be-processed workpiece; a frame; the grinding assembly is arranged on the frame and used for grinding and removing the reaction layer. 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The hardness of the reaction layer is smaller than that of the to-be-machined part, the removal strength of the grinding assembly can be reduced, then the risk that cracks are generated in the non-machining area of the to-be-machined part in the grinding machining process is avoided, the surface quality of the to-be-machined part after grinding machining is improved, the grinding speed is increased, and the removal efficiency of the</description><subject>CLADDING OR PLATING BY SOLDERING OR WELDING</subject><subject>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</subject><subject>MACHINE TOOLS</subject><subject>METAL-WORKING NOT OTHERWISE PROVIDED FOR</subject><subject>PERFORMING OPERATIONS</subject><subject>SOLDERING OR UNSOLDERING</subject><subject>TRANSPORTING</subject><subject>WELDING</subject><subject>WORKING BY LASER BEAM</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2022</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZHD3SSxOLVJIL8rMS8nMS1dISS3LTE7VQQjkppZk5KfoKCSnFiXmZiYrFCQWlSgk5qUoFGek5uQoJBYXp-Ym5VTyMLCmJeYUp_JCaW4GRTfXEGcP3dSC_PjU4oLE5NS81JJ4Zz9DQxMTc2MjQzNHY2LUAAAkyTNi</recordid><startdate>20220513</startdate><enddate>20220513</enddate><creator>HU MAOSHUN</creator><scope>EVB</scope></search><sort><creationdate>20220513</creationdate><title>Laser grinding device, grinding method, ceramic part and shell assembly</title><author>HU MAOSHUN</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN114473216A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2022</creationdate><topic>CLADDING OR PLATING BY SOLDERING OR WELDING</topic><topic>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</topic><topic>MACHINE TOOLS</topic><topic>METAL-WORKING NOT OTHERWISE PROVIDED FOR</topic><topic>PERFORMING OPERATIONS</topic><topic>SOLDERING OR UNSOLDERING</topic><topic>TRANSPORTING</topic><topic>WELDING</topic><topic>WORKING BY LASER BEAM</topic><toplevel>online_resources</toplevel><creatorcontrib>HU MAOSHUN</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>HU MAOSHUN</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Laser grinding device, grinding method, ceramic part and shell assembly</title><date>2022-05-13</date><risdate>2022</risdate><abstract>The invention provides a laser grinding device, a grinding method, a ceramic part and a shell assembly. 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| language | chi ; eng |
| recordid | cdi_epo_espacenet_CN114473216A |
| source | esp@cenet |
| subjects | CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM |
| title | Laser grinding device, grinding method, ceramic part and shell assembly |
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