Laser grinding device, grinding method, ceramic part and shell assembly

The invention provides a laser grinding device, a grinding method, a ceramic part and a shell assembly. The laser grinding machining device comprises an objective table used for placing a workpiece to be machined; laser emitted by the laser emission source enters the laser processing system, the las...

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1. Verfasser: HU MAOSHUN
Format: Patent
Sprache:chi ; eng
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Zusammenfassung:The invention provides a laser grinding device, a grinding method, a ceramic part and a shell assembly. The laser grinding machining device comprises an objective table used for placing a workpiece to be machined; laser emitted by the laser emission source enters the laser processing system, the laser irradiates the surface of a to-be-processed workpiece to form a reaction layer, and the hardness of the reaction layer is smaller than that of the to-be-processed workpiece; a frame; the grinding assembly is arranged on the frame and used for grinding and removing the reaction layer. The hardness of the reaction layer is smaller than that of the to-be-machined part, the removal strength of the grinding assembly can be reduced, then the risk that cracks are generated in the non-machining area of the to-be-machined part in the grinding machining process is avoided, the surface quality of the to-be-machined part after grinding machining is improved, the grinding speed is increased, and the removal efficiency of the