Method for reducing copper powder falling in surface treatment process of electrolytic copper foil

The invention discloses a method for reducing copper powder falling in the surface treatment process of an electrolytic copper foil. The method comprises the following steps that S1, a curing electrolyte is prepared, specifically, the concentration of copper ions in the curing electrolyte is 21-26 g...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	HONG BINGHUA, ZONG DAOQIU, LIU CHAO
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	APPARATUS THEREFOR CHEMISTRY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES METALLURGY PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
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