Method for reducing copper powder falling in surface treatment process of electrolytic copper foil

The invention discloses a method for reducing copper powder falling in the surface treatment process of an electrolytic copper foil. The method comprises the following steps that S1, a curing electrolyte is prepared, specifically, the concentration of copper ions in the curing electrolyte is 21-26 g/L, the concentration of hydrogen ions in the curing electrolyte is 100-110 g/L, and the temperature is 40-45 DEG C; and S2, electroplating the electrolytic copper foil: putting the roughened copper foil in the roughening tank into a curing tank containing a curing electrolyte for electroplating. The method can solve the problem of high separation risk of copper powder on the surface of the current electrolytic copper foil, so that a layer of copper with more stable compactness is covered on crystals formed on a copper foil coarsening layer through a new curing process, the separation of the copper powder is reduced, the electrolytic copper foil with compact and uniform crystal grains and excellent mechanical prope