Semiconductor packaging structure

The invention relates to a semiconductor packaging structure, and the structure comprises a substrate which is provided with a core layer; the top transformer and the bottom transformer are positioned on two opposite sides of the core layer; and the first connecting piece is connected with the top transformer and the bottom transformer. Each of the top transformer and the bottom transformer is composed of two coils which are mutually staggered and wound separately. 本发明涉及一种半导体封装结构，该半导体封装结构包括：基板，具有芯层；顶部变压器和底部变压器，位于芯层的相对两侧；第一连接件，连接顶部变压器与底部变压器。顶部变压器和底部变压器中的每个是由两个相互交错且分隔绕制的线圈组成。