Ball valve sealing structure for thermal management module
The invention relates to a ball valve sealing structure for a thermal management module, the ball valve sealing structure comprises a thermal management module shell and a ball valve, a sealing element is arranged between the ball valve and a corresponding runner on the thermal management module she...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention relates to a ball valve sealing structure for a thermal management module, the ball valve sealing structure comprises a thermal management module shell and a ball valve, a sealing element is arranged between the ball valve and a corresponding runner on the thermal management module shell, and the sealing element is fixedly arranged in a positioning groove on the thermal management module shell. The sealing piece is integrally formed by injection molding of an injection molding grade ETFE material, and compared with a traditional ball valve sealing assembly, the sealing piece is simpler in structure, easy to assemble and particularly suitable for application occasions with limited space layout; an integrated injection molding process is adopted, the number of parts is reduced, the tolerance of an assembly system is reduced, and the sealing reliability is higher; a sealing element designed and developed by using the material is stable in performance index and good in sample experiment data sealing |
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