Treating fluid for rapidly increasing chemical gold leaching thickness and application of treating fluid
The invention belongs to the technical field of chemical plating, and discloses a treating fluid for rapidly increasing the chemical gold leaching thickness and application of the treating fluid. The treating fluid is an HCl-CuCl2 solution, an H2SO4-H2O2 solution or a ceric sulfate solution; the HCl...
Gespeichert in:
Hauptverfasser: | , , , , , , , |
---|---|
Format: | Patent |
Sprache: | chi ; eng |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Zusammenfassung: | The invention belongs to the technical field of chemical plating, and discloses a treating fluid for rapidly increasing the chemical gold leaching thickness and application of the treating fluid. The treating fluid is an HCl-CuCl2 solution, an H2SO4-H2O2 solution or a ceric sulfate solution; the HCl-CuCl2 solution is prepared by dissolving 20 to 100 ml of concentrated hydrochloric acid and 5 to 15 g of CuCl2 in 1 L of water; h2SO4 in the H2SO4-H2O2 solution is concentrated sulfuric acid, and the concentration of H2O2 is 27 to 33 weight percent; the volume ratio of the H2SO4 to the H2O2 is (1-3): (3-8); the concentration of the ceric sulfate solution is 0.1 to 2.5 g/L. Under the condition of the same reaction time, the treatment liquid is adopted for pretreatment for 0.5-5 min, the chemical gold leaching thickness of the chemical nickel plating layer can be rapidly increased, and the method has the advantages of being simple in process, low in cost, mild in needed condition and the like.
本发明属化学镀技术领域,公开了一种快速提升化 |
---|