RESIN-SEALING ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING SAME

The invention provides a resin-sealed electronic component and a method for manufacturing the same, the resin-sealed electronic component can seal an electronic component main body by using a resin housing containing a sealing member formed by molded resin, and can inhibit deformation, damage and the like of the electronic component main body caused by the molten molded resin. In a torque sensor (1), a detection unit (2) is sealed with a resin case (3). The resin case (3) is provided with: a first resin member (4) and a second resin member (5) arranged in the radial direction across a housing space (30) for housing the detection unit (2); and a sealing member (6) formed from a molded resin so as to cover at least a part of each of the first resin member (4) and the second resin member (5). A portion of the first resin member (4) and a portion of the second resin member (5) are arranged in the axial direction to form a suppression structure that suppresses entry of the molded resin into the housing space (30).