METHOD AND APPARATUS FOR INTERCONNECTING USING MICROCHANNELS

The present invention provides a pattern of microchannels formed on a major surface of a substrate on a side opposite an adhesive surface of the substrate. A through hole extends through the substrate and is connected to the pattern of microchannels. A solid circuit die is adhesively bonded to the adhesive surface of the substrate. The contact pad of the solid circuit die at least partially overlies and faces the via. A conductive channel trace is formed to electrically connect to the solid state circuit die via the via. 本发明提供了微通道的图案，该微通道的图案形成在基底的主表面上，在与该基底的粘合剂表面相背的侧上。通孔延伸穿过该基底并且连接到该微通道的图案。固体电路管芯粘附地粘结到该基底的该粘合剂表面。该固体电路管芯的该接触垫至少部分地覆盖在该通孔上并且面向该通孔。形成导电通道迹线以经由该通孔电连接到该固体电路管芯。