Wiring structure
The wiring structure (100) is mounted using a ball grid array (90). The base body (80) is made of a dielectric. The first differential line (131) is provided in the base body (80) and has a first signal line (11) and a second signal line (12). The second differential line (132) is provided in the ba...
Gespeichert in:
Hauptverfasser: | , |
---|---|
Format: | Patent |
Sprache: | chi ; eng |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Zusammenfassung: | The wiring structure (100) is mounted using a ball grid array (90). The base body (80) is made of a dielectric. The first differential line (131) is provided in the base body (80) and has a first signal line (11) and a second signal line (12). The second differential line (132) is provided in the base body (80) and has a third signal line (13) and a fourth signal line (14). The first pad (21) is connected to the first signal line (11). The second pad (22) is connected to the second signal line (12). The third pad (23) is adjacent to the second pad (22) with the ground region (20) therebetween, and is connected to the third signal line (13). And the fourth bonding pad is connected with the fourth signal line. The ground region (20) includes a sandwiched portion (20i) between the second pad (22) and the third pad (23), and a non-sandwiched portion (20n) offset from the sandwiched portion (20i). The base body (80) has a trench (TR).
布线构造(100)使用球栅阵列(90)进行安装。基体(80)由电介质构成。第一差动线路(131)设置于基体(80)中,具有第一信号线路(11)以及第二信号线路( |
---|