LED display device and preparation method and application thereof

The invention discloses an LED display device and a preparation method and application thereof, and the LED display device comprises a driving circuit substrate; electrode pins are arranged in a partial region of the first surface of the driving circuit substrate; an LED light-emitting device is arr...

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Bibliographische Detailangaben
Hauptverfasser:	DENG WENJIAN, ZHANG YUANYUAN
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SEMICONDUCTOR DEVICES SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	The invention discloses an LED display device and a preparation method and application thereof, and the LED display device comprises a driving circuit substrate; electrode pins are arranged in a partial region of the first surface of the driving circuit substrate; an LED light-emitting device is arranged on the surface of the electrode pin; a first heat dissipation layer is arranged in the remaining area of the first surface of the driving circuit substrate; a second heat dissipation layer is arranged on the surface of the first heat dissipation layer and the surface of the LED light-emitting device; and a third heat dissipation layer is arranged on the surface of the second heat dissipation layer. Wherein the first heat dissipation layer achieves the effects of homogenizing a thermal field and primarily dissipating heat, heat is prevented from being concentrated in the LED light-emitting device, the second heat dissipation layer and the third heat dissipation layer further conduct heat of the LED light-emitt