Assembling performance detection method and device, bill of material detection method and medium

The invention provides a detection method for detecting the assemblability of a component. The assemblability of the component is detected based on a circuit board model and a component model in a simulation scene; the circuit board model comprises a soldering-aid layer with a plurality of soldering-aid surfaces, the component model comprises a contact layer with a plurality of contact surfaces, the plurality of soldering-aid surfaces are in one-to-one correspondence with the plurality of contact surfaces, and the contact surfaces of the component model are mounted to the soldering-aid surfaces corresponding to the contact surfaces along the assembly direction; the detection method comprises the following steps: acquiring a matching result of the contact surface and the weld-aid surface in the assembly direction; and according to the matching result, generating an assemblability result of the component model, the simulation technology is applied, the assembly effect of the component model on the circuit board