Method for electroplating copper on copper substrate

The invention discloses a method for electroplating copper on a copper substrate, which comprises the following steps of: electroplating the copper substrate by using a first electroplating solution of a matt agent so as to form a first copper-plated layer on the copper substrate; and then electroplating the copper substrate by adopting a second electroplating solution containing a gloss agent to form a second copper plating layer on the first copper plating layer. According to the method, the technological process is optimized, electroplating is conducted through the electroplating liquid of the matt agent, copper ion deposition continues to conduct epitaxial growth along crystals of the copper base material, pure copper crystals are formed, and therefore the first copper plating layer free of impurities is formed on the copper base material in an electroplating mode; and then electroplating is conducted on the first copper plating layer through electroplating liquid containing a gloss agent to form a flat a