Protective multilayer coating for processing chamber components

The present disclosure relates to protective multilayer coatings for processing chambers and processing chamber components. In one embodiment, the multi-layer protective coating includes a metal nitride layer and an oxide layer disposed thereon. In one embodiment, the multi-layer protective coating further includes a nitrogen oxide interlayer and/or a fluorine oxide layer. A multi-layer protective coating may be formed on a metal alloy or ceramic substrate, such as a processing chamber or processing chamber component used in the field of electronic device fabrication, such as semiconductor device fabrication. In one embodiment, metal nitride and oxide layers are deposited on a substrate by atomic layer deposition. 本公开内容涉及用于处理腔室及处理腔室部件的保护性多层涂层。在一个实施方式中，多层保护性涂层包括金属氮化层及设置于其上的氧化层。在一个实施方式中，多层保护性涂层进一步包括氮氧化夹层和/或氟氧化层。多层保护性涂层可形成于金属合金或陶瓷基板上，例如在电子装置制造的领域中，例如半导体装置制造使用的处理腔室或处理腔室部件。在一个实施方式中，金属氮化层及氧化层通过原子层沉积沉积于基板上。