Production process for improving thermoelectric separation efficiency of circuit board through via hole metal paste plugging method

The invention belongs to the field of heat conduction of a glass fiber (paper) circuit board, particularly relates to a production process for improving the thermoelectric separation efficiency of a circuit board through a via hole metal paste plugging method, and aims to solve the problems that existing circuit boards which have high heat conduction requirements and adopt metal substrates or ceramic substrates and the like and are good in heat conduction (3-8W/(M * K)) are designed in a single-layer circuit mode; in order to solve the problem that an existing glass fiber circuit board and an existing paper circuit board cannot meet the requirement for high heat conduction, the following scheme is provided, and the method comprises the following steps that S1, a via hole circuit is designed below a heat conductor; s2, corresponding hole sites are formed in the printing steel mesh; s3, the hole sites are filled with metal paste through a printing machine; s4, mounting an electronic device through SMT; and S5,