Wafer glue uniformizing equipment

The invention discloses wafer glue uniformizing equipment which comprises the components of a supporting member which is provided with three positioning groups, the three positioning groups are uniformly arranged at intervals along the circumferential direction of a first circumference, and each pos...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	YE JINLIN, KUANG SHIYIN, GAO SICHENG
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY MATERIALS THEREFOR ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS
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